1. MIDA Bond-Oak Grove School - Laserfiche WebLink

ARTICLE 4 THE LOAN, BASIC PAYMENTS AND ADDITIONAL PAYMENTS SECTION 4.01. THE LOAN. The Issuer agrees, upon the terms and conditions herein specified, to lend to the Corporation the proceeds received by the Issuer from the sale ofthe Bonds, excluding any accrued interest, by causing such proceeds to be deposited with the Lender for disposition as provided herein and in the Resolution. The amount ofthe Loan shall also be deemed to include any "discount" or any other amount by which the aggregate price at which the Issuer sells the Bonds to the Lender is less than the aggregate principal amount of the Bonds, plus accrued interest; and the obligation of the Issuer to make the Loan shall be deemed fully discharged upon so depositing the proceeds of the Bonds with the Lender. SECTION 4.02. BASIC PAYMENTS. During the term of this Loan Agreement, as and for Basic Payments the Corporation will pay to the Lender for deposit in the Bond Account on or before each Payment Date (whether at maturity, or by redemption or acceleration as provided in the Bonds, by declaration or otherwise), an amount equal to the principal of, premium, if any, and interest due on the Bonds. If on any Payment Date the balance in the Bond Account is insufficient to make the required payments of principal of, premium, if any, and interest on the Bonds, the Corporation shall immediately upon demand by the Lender pay all amounts to the Lender and the Lender shall deposit any such deficiency into the Bond Account. Any moneys on deposit in the Bond Account on any Payment Date in excess of the amount required for payment of principal of, premium, if any, and interest on the Bonds shall be credited to the Corporation's next payment then due under Sections 4.02 and 4.03 hereof. All Basic Payments shall be made directly to the Lender at its principal office or at such other office agreed to by the Lender, for the account of the Issuer. Overdue Basic Payments shall bear interest at the rate then borne by the Bonds, payable to the Lender for the account of the Issuer. The Corporation may, pursuant to Section 8.01 hereof, prepay all or part of the Basic Payments required under this Section 4.02. Such prepayments shall not in any way alter or suspend any obligations of the Corporation under this Loan Agreement except to the extent the same result in a credit against Basic Payments as provided in this Section 4.02 or the payment and retirement of Bonds in accordance with the Resolution. SECTION 4.03. ADDITIONAL PAYMENTS. The Corporation agrees to pay to the Issuer, upon demand, as Additional Payments under this Loan Agreement, all reasonable expenses incurred by the Issuer in relation to the Facilities which are not otherwise required to be paid by the Corporation under the terms of this Loan Agreement, including all permit and license fees required under regulations or codes of the Issuer, provided that the Corporation or the Lender shall have given written approval to the incurring of such expenses. 4-1